Call For Paper

ChipEx2025 is the major annual event of the Israeli semiconductor industry.

ChipEx2025 invites any person or company involved with the semiconductor industry.

to submit a paper addressing a specific problem or a case study related to the process of semiconductor design, development, implementation and manufacturing. 

Submissions must be made via e-mail: info@chiportal.co.il by March 4, 2025 no later than 7:00pm Israel time. Authors of accepted papers will be invited to present their topic at the ChipEx2025 conference, scheduled for May 13, 2025 in Tel Aviv, Israel.

Topics of Interest

ChipEx2025 seeks papers addressing one of the following tracks:

·       Silicon Solutions for the next digital generation

·       Power Management & Signal Integrity

·       Analog Design, RF and Sensors

·       Physical Design and Manufacturability

·       IP for SoC & NoC

·       Verification, Simulation, Testing & Security

·       Manufacturing, Packaging and Post Silicon processes

·       Emerging and creative design technologies

·       Users Track – sharing user experience with industry colleagues

The main theme of ChipEx2025 is Designing the Future - Where Cores Meet Intelligence.

To make it easy for potential speaking applications, the ChipEx2025 steering committee has decided to introduce a series of key topics that are especially interesting for our audience.  Papers that will address these topics will be treated with higher priority.

Here are the key topics of ChipEx2025:

• ·       New solutions for AI processing on device and/or AI on the cloud
• ·       Using AI for EDA design tools and verification
• ·       How can quantum computing replace current technology nodes
• ·       The advantages of heterogeneous integration and Chiplets 
• ·       Pluggable solutions for data center connectivity
• ·       Vertical Integration of power
• ·       Generative AI in EDGE computing   
• ·       Designing dedicated AI chips that are optimized for specific tasks
• ·       Challenges in designing chips for military application
• ·       Simplifying the transformation process from FPGA to ASIC
• ·       Customer experience: Using AI for Verification or Simulation.
• ·       The Advantages of PIM (Processing-in-Memory) for AI Applications
• ·       Can ChatGPT shorten the design cycle?
• ·       The foundries show – each foundry will present its special capabilities
• ·       New solutions for on chip power dissipation
• ·       Advantages and disadvantages of 3D IC technologies
• ·       How can RISC-V become alternative to x86 and Arm in HPC
• ·       Implementing Silicon Photonics with ASIC design
• ·       VD FET and other innovative manufacturing technologies
• ·       HW emulation and verification on the cloud
• ·       Product Life Management, Automation and Monitoring
• ·       Reliability, qualification and RMA (Return Material Authorization) procedures
• ·       AI implementation in chip manufacturing
• ·       The impact of Multi Physics characteristics on timing signoff, power integrity and thermal reliability
• ·       3D & 4D Packaging, Heterogeneous Systems and other trends in advanced IC Packaging
• ·       Designing processors for data centers and the cloud
• ·       On-Chip Security and Cyber-Resilient Chip Technologies
• ·       Integrated circuit design verification tools including Logic Verification
• ·       New design & implementations for medical applications
• ·       Manufacturing challenges in 2nm and below
• ·       Machine vision and image sensors-based technologies
• ·       Advanced sensors for IoT & Smart Cities applications
• ·       SOC design for digital health & wearable applications
• ·       What next after 5G?
• ·       New trends in semiconductor manufacturing
• ·       How to improve yields in chip manufacturing
• ·       Reducing TTM (Time To Market) for System On Chip 
• ·       Using FPGA to address the needs of today's applications including 5G, Automotive, HPC, HMB and more
• ·       The Advantages and challenges in silicon photonics
• ·       Generative AI in Chip, System, and Product Design
• ·       Using AI to migrate from one nanotechnology to another
• ·       The latest in RF and millimeter wave design
• ·       How to ensure data security when using GenAI

 
Submission Process

The following is the process for any paper submission.

1. The paper should only address one of the selected topics (see below a detailed list of interesting topics). 

2.      Each paper must include an abstract of approximately 50 -100 words clearly stating the impact/result or significant contribution of the submitted topic.

3.      The entire paper should not be longer than two pages (including the abstract)

4.      The author must be ready to present the topic at ChipEx2025. The author or his/her representative will have 20 minutes to present the paper.

5.      Presentations should not be biased or focused towards the author's company or business interests.

6.      Papers which were previously published or simultaneously under review by another conference will be rejected, unless received special authorization by the organizers of ChipEx2025.

7.      Authors of accepted papers must sign a "copyright release form".

 

Submissions not complying with these terms will be rejected.